Pastes UVs that were previously copied to the selected face. For information, see Copy Attributes Options. Wet etch undercut with a 1.3 lateral etch rate.Copies the selected UVs for a selected face to the clipboard so they can be copied (pasted) to another face. You'll want to be clear if you are referring to the total change in the feature size or the sizing per side. For example, a square that is 1.25um per side that is sized -0.125um per side will shrink the square to 1.00um per side, a total shink of -0.25um in both X and Y dimensions. Sizing per side means the distance each edge of a polygon moves towards the interior or exterior of the polygon. Sizing is typically specified at drawn dimensions (1X) before reticle scaling is applied. You'll want to be clear which process you are referring to but the concepts apply equally well to both. Sizing is typically applied both in the mask process (by the maskshop) and in the wafer process (by the mask designer). The type of sizing your apply depends on the type of photoresist (positive or negative) and the type of etch (wet or dry). Sizing is a bias applied to your digitized data to account for lateral edge growth during etching. The next wavelength we expect to use for photolithography in a production mode will be 13.5nm in the extreme ultraviolet (EUV). Photolithography started with wavelengths in the optical spectrum (436nm) and has advanced to near ultraviolet (365nm) and deep ultraviolet (248nm, 193nm) wavelengths. Shortening the wavelength of light produces higher resolution and smaller features. The wavelength of the light is one of the key factors that determines the resolution of the pattern. The hard polymer is then removed leaving the substrate (silicon wafer or chrome) etched with the same pattern that was exposed with light.We etch the exposed substrate (where the polymer was removed) with an acid (wet etch) or a plasma (dry etch).We use this hard polymer as a template to etch the substrate. The soft polymer is washed away leaving a pattern of hard polymer on top of the substrate. Depending on the type of polymer used, it either softens or hardens where it is exposed to light.
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